研磨抛光颗粒流剪切膨胀及力链演变的力学机制

冯启高; 甘梓辰; 孟凡净

doi:10.13433/j.cnki.1003-8728.20230047

研磨抛光颗粒流剪切膨胀及力链演变的力学机制

doi: 10.13433/j.cnki.1003-8728.20230047

1.
河南科技学院机电学院, 河南新乡 453003
2.
河南工学院机械工程学院, 河南新乡 453003

基金项目:

国家自然科学基金项目 52175397

国家自然科学基金项目 51605150

河南省高等学校重点科研项目 22A460019

详细信息

作者简介:
冯启高, 教授, 硕士生导师, 博士, fqg@hist.edu.cn

通讯作者:
孟凡净, 教授, 硕士生导师, 博士, mengfanjing0901@126.com

中图分类号: TG156
计量
- 文章访问数: 13
- HTML全文浏览量: 6
- PDF下载量: 0
- 被引次数: 0
出版历程
- 收稿日期: 2022-05-17
- 刊出日期: 2024-07-25

Mechanical Mechanisms of Shear Dilatancy and Force Chain Evolution in Abrasive Polishing Granular Flow

1.
School of Mechanical and Electrical Engineering, Henan Institute of Science and Technology, Xinxiang 453003, He′nan, China
2.
School of Mechanical Engineering, Henan Institute of Technology, Xinxiang 453003, He′nan, China

摘要

摘要: 将研磨抛光作为后处理可以提高工件的表面质量, 如何将研磨抛光工艺价值最大化是本文首要解决的问题。由于颗粒流润滑既适用于极端环境又具有环保作用, 因此本文将颗粒流用于研磨抛光。通过离散单元法建立平行板结构模型, 将颗粒流作为第三体填充至摩擦副间隙, 将工件表面与刀具作为第一体对颗粒流体系施加法向力和剪切力, 对研磨抛光过程进行数值模拟。研究结果表明: 单个颗粒剪切膨胀过程可以分为上升阶段、最高点阶段和下降阶段, 不同阶段的弱力链方向都偏向于x轴, 其中上升阶段强弱力链方向稳定, 可提高工件的加工效率以及表面质量。当载荷的较大, 会使强弱力链的分布律与承载率稳定, 当载荷较大及较小时, 剪切膨胀率降低, 强力链方向更偏向于x轴。通过本研究, 可以将不易检测的力链和剪切膨胀现象进行数值模拟, 为研磨抛光条件下使用颗粒流提供了理论基础。
- 研磨抛光 /
- 颗粒流 /
- 离散单元法 /
- 力链 /
- 剪切膨胀
Abstract: The use of grinding and polishing as post processing can improve the surface quality of a workpiece. This paper mainly solves the problem of how to maximize the values of grinding and polishing processes. Since granular flow lubrication is suitable for extreme environment and environmental protection, the paper uses granular flow for grinding and polishing. A parallel plate model was established with the discrete element method. Granular flow was used as the third body to fill the gap between friction pairs, and the workpiece surface and tool were used as the first body to apply normal force and shear force to the granular flow system. The polishing process was numerically simulated. The results show that the shear dilatancy process of a single particle can be divided into rising stage, peak stage and falling stage. The weak chain direction in different stages is inclined to the x axis. In the rising stage, the weak chain direction is stable and can improve the machining efficiency and surface quality of the workpiece. When the load is large, the distribution law and the bearing rate of strong and weak force chains are stable. When the load is small, the shear dilatancy rate decreases and the strong chain direction is inclined to the x axis. This study numerically simulates the force chain and shear dilatancy that are not easily detected, thus providing a theoretical basis for the use of granular flow under the condition of grinding and polishing.
- grinding and polishing /
- granular flow /
- discrete element method /
- force chain /
- shear dilatancy

HTML全文

图 1 研磨抛光颗粒流的离散元数值模型(单位：μm)

Figure 1. The numerical model with discrete elements of granular flow on grinding and polishing(unit: μm)

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图 2 仿真模拟流程

Figure 2. The simulation procedure

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图 3 剪切膨胀的过程

Figure 3. The process of shear dilatancy

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图 4 加载面的位移过程

Figure 4. The displacements process of loading surface

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图 5 驱动面的接触力变化

Figure 5. The change of contact force on driving surface

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图 6 最大不平衡力与不平衡力分量比Q_u的变化

Figure 6. The change of maximum unbalance force and unbalance force ratio Q_u

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图 7 接触力分量比Q_c的变化

Figure 7. The change of contact force ratio Q_c

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图 8 弱力链的分布律与承载率

Figure 8. The distribution rate and bearing rate of weak force chain

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图 9 不同载荷下最大非平衡力的变化

Figure 9. The change of maximum unbalance force under different load

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图 10 不同载荷下剪切膨胀率λ_s的变化

Figure 10. The change of shear dilatancy ratio λ_s under different load

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图 11 不同载荷下最大接触力的变化

Figure 11. The change of maximum contact force under different loads

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图 12 不同载荷下弱力链的分布律与承载率

Figure 12. The distribution rate and bearing rate of weak force chain under different loads

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图 13 接触力分量比Q_c随载荷的变化

Figure 13. The change of contact force ratio Q_c with different loads

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表 1 参数名称及数值

Table 1. The names and values of parameters

参数	数值
上部加载面载荷P/10^-4 N	6.60
加载面密度/(kg·m^-3)	8 190
加载面剪切模量/GPa	77.20
加载面泊松比	0.30
加载面与颗粒的摩擦因数	0.36
颗粒的粒径D/μm	40
颗粒间摩擦因数	0.24
下部驱动面速度v/(m·s^-1)	0.50
驱动面与颗粒间摩擦因数	0.32
颗粒密度/(kg·m^-3)	2 400
颗粒的剪切模量/GPa	198
颗粒的泊松比	0.17
颗粒的层数L	3

下载: 导出CSV

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