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FDM制备晶格点阵结构体的一种卡扣式打印方法的研究

李振华 王健 石学智

李振华,王健,石学智. FDM制备晶格点阵结构体的一种卡扣式打印方法的研究[J]. 机械科学与技术,2023,42(2):212-217 doi: 10.13433/j.cnki.1003-8728.20200599
引用本文: 李振华,王健,石学智. FDM制备晶格点阵结构体的一种卡扣式打印方法的研究[J]. 机械科学与技术,2023,42(2):212-217 doi: 10.13433/j.cnki.1003-8728.20200599
LI Zhenhua, WANG Jian, SHI Xuezhi. Study on Buckle Printing Method for Preparing Lattice Structure by FDM[J]. Mechanical Science and Technology for Aerospace Engineering, 2023, 42(2): 212-217. doi: 10.13433/j.cnki.1003-8728.20200599
Citation: LI Zhenhua, WANG Jian, SHI Xuezhi. Study on Buckle Printing Method for Preparing Lattice Structure by FDM[J]. Mechanical Science and Technology for Aerospace Engineering, 2023, 42(2): 212-217. doi: 10.13433/j.cnki.1003-8728.20200599

FDM制备晶格点阵结构体的一种卡扣式打印方法的研究

doi: 10.13433/j.cnki.1003-8728.20200599
基金项目: 国家自然科学基金项目(51205359)与舟山市科技计划项目(2019C21014)
详细信息
    作者简介:

    李振华(1976−),硕士生导师,研究方向为智能制造,表面工程及摩擦学, lizh760905@126.com

    通讯作者:

    石学智,讲师,博士研究生,shixuezhi@zjou.edu.cn

  • 中图分类号: TH164

Study on Buckle Printing Method for Preparing Lattice Structure by FDM

  • 摘要: 熔融沉积技术(Fused deposition modeling,FDM)打印晶格点阵结构时,存在着打印件机械性能差、支撑材料难去除的问题。针对这些问题,本文将晶格结构体分解成数个二维模型,通过FDM进行分体打印然后利用卡扣配合重新组装。利用这种分体打印工艺深入探索了BCC、BCC-Z、F2CC和F2CC-Z这4种典型结构类型的晶格体结构的表面形貌和机械性能,并与传统一体式打印进行对比。发现该卡扣式分体方法实现了打印物体表面质量的改善、打印时间和打印材料的节省以及抗压性能的提升。该研究为实现3D打印制备晶格结构体提供了一种途径,并为选择合适的晶格类型提供了参考。
  • 图  1  F2CC晶格未去除支撑与去除支撑打印件比较

    图  2  4种晶格结构体的结构示意图

    图  3  BCC-Z晶格结构分体打印

    图  4  4种晶格结构体打印实物

    图  5  支柱厚度为2 mm的BCC晶格结构一体与分体打印模型的抗压测试分析

    图  6  支柱厚度为2.5 mm的BCC、BCC-Z、F2CC和F2CC-Z晶格结构体的打印时间和材料

    图  7  支柱厚度为2 mm的 BCC、BCC-Z、F2CC和F2CC-Z晶格结构体的最大可承受压力

    图  8  支柱厚度为2 mm的4种晶格结构最大可承受压力与耗材的比值

    图  9  一体和分体打印制造不同支柱厚度的BCC、BCC-Z、F2CC和F2CC-Z晶格结构体的最大可承受压力

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出版历程
  • 收稿日期:  2021-03-30
  • 网络出版日期:  2023-03-27
  • 刊出日期:  2023-02-25

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