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虚拟切片无损测量片层质量检测系统优化研究

甘勇 莫宗杰

甘勇, 莫宗杰. 虚拟切片无损测量片层质量检测系统优化研究[J]. 机械科学与技术, 2017, 36(8): 1260-1264. doi: 10.13433/j.cnki.1003-8728.2017.0819
引用本文: 甘勇, 莫宗杰. 虚拟切片无损测量片层质量检测系统优化研究[J]. 机械科学与技术, 2017, 36(8): 1260-1264. doi: 10.13433/j.cnki.1003-8728.2017.0819
Gan Yong, Mo Zongjie. Research on Precision Optimization of Inspection System Fornon-destructive Measurement of Chip Layer Mass via Virtual Slice[J]. Mechanical Science and Technology for Aerospace Engineering, 2017, 36(8): 1260-1264. doi: 10.13433/j.cnki.1003-8728.2017.0819
Citation: Gan Yong, Mo Zongjie. Research on Precision Optimization of Inspection System Fornon-destructive Measurement of Chip Layer Mass via Virtual Slice[J]. Mechanical Science and Technology for Aerospace Engineering, 2017, 36(8): 1260-1264. doi: 10.13433/j.cnki.1003-8728.2017.0819

虚拟切片无损测量片层质量检测系统优化研究

doi: 10.13433/j.cnki.1003-8728.2017.0819
基金项目: 

国家自然科学基金资助(51665008,51265007)

详细信息
    作者简介:

    甘勇(1973-),教授,博士,硕士生导师,研究方向为机械设计制造及自动化,ganyong@guet.edu.cn

Research on Precision Optimization of Inspection System Fornon-destructive Measurement of Chip Layer Mass via Virtual Slice

  • 摘要: 基于虚拟切片无损测量方法具有测量精度高、成本低、数据测量与处理快、可测量物体内部轮廓等特点。由于测量质量精度高,其测量装置中精密片层质量检测系统精度是研究的关键技术之一,直接影响微小单元体质量的计算精度。运用误差补偿与误差影响因素正交实验等技术手段,对精密片层质量检测系统的误差分析及优化。实验结果证明,实现了片层质量平均相对误差从19.36%降至5.52%,并且在各片层厚度条件下,相对误差皆保持平稳幅度。
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出版历程
  • 收稿日期:  2016-04-08
  • 刊出日期:  2017-08-05

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