单晶硅成型加工刀具损耗建模分析与实验研究

摘要: 放电成型加工中的刀具损耗直接影响着加工精度，在单晶Si放电加工可行性的基础上，分析了峰值电流、脉冲宽度以及脉冲间隔对刀具损耗的影响。采用RSM中的中心组合设计实验，建立了与峰值电流、脉冲宽度、脉冲间隔等工艺参数相关的刀具损耗预测模型，用Design-Expert 8.0对刀具损耗与工艺参数的2阶响应曲面进行了分析。方差分析结果表明，预测模型具有较好的拟合程度和适应性。采用满意度函数（DFA）获得了单晶Si放电加工刀具损耗的最佳工艺参数组合，最佳工艺参数下的实验结果与模型预测结果平均相对误差为5.1%。验证实验表明，该模型对刀具损耗的预测是准确的，并且能实现相应的半导体材料的放电成型加工过程中的刀具损耗预测。
- 成型加工 /
- 半导体 /
- 刀具损耗 /
- 响应曲面法
Abstract: The loss of cutting tool in the electro discharge machining will directly influence the machining precision. Based on the feasibility of the electro discharge machining of the monocrystalline silicon, the effect of the peak current, pulse width and pulse interval on the loss of cutting tool is analyzed. The prediction model for the loss of cutting tool is established via RSM, considering the peak current, pulse width and pulse interval and other process parameters. The second order response surface of the loss of cutting tool and the process parameters is analyzed via Design-Expert 8.0. The analyzed results of variance show that the prediction model has a good fitting degree and adaptability. It uses satisfaction function (DFA) to obtain the best process parameters combination of the loss of cutting tool in the process of the electro discharge machining of the monocrystalline silicon. The average relative error between the prediction results and the experimentalunder the optimum processing parameters is 5.1%. The verification test show that the prediction model for the cutting tool loss is accurate, and the prediction of the loss of cutting tool in electro discharge machining for related semiconductor materials can be realized.
- molding processing /
- semiconductor /
- loss of cutting tool /
- response surface method

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