钴铬钼合金超声振动辅助抛光力与表面质量的探究

于保军; 吴爽; 辛成磊; 贾茹; 谷岩

doi:10.13433/j.cnki.1003-8728.20220248

钴铬钼合金超声振动辅助抛光力与表面质量的探究

doi: 10.13433/j.cnki.1003-8728.20220248

1.
长春工业大学机电工程学院，长春　130012

基金项目: 吉林省科技发展计划（20190201254JC）

详细信息

作者简介:
于保军，教授，博士， yubaojun@ccut.edu.cn

通讯作者:
谷岩，副教授，博士，guyan@ccut.edu.cn

中图分类号: TG580
计量
- 文章访问数: 32
- HTML全文浏览量: 19
- PDF下载量: 0
- 被引次数: 0
出版历程
- 收稿日期: 2021-12-29
- 刊出日期: 2024-03-25

Study on Ultrasonic Vibration Assisted Polishing Force and Surface Quality of CoCrMo Alloy

1.
School of Mechatronic Engineering, Changchun University of Technology, Changchun 130012, China

摘要

摘要: 针对钴铬钼合金的难加工性，采用超声振动辅助抛光的加工方法改善其加工效果。根据超声振动装置的运动特性，分析了单磨粒运动速度、单磨粒与工件接触轨迹坐标和单磨粒受力，建立了抛光系统的抛光力预测模型，讨论了主轴转速、进给速度和抛光深度对钴铬钼合金表面质量的影响并用实验验证了预测模型的合理性。结果表明：抛光力预测模型和实验的变化趋势一致，抛光力随着主轴转速和抛光深度的增大而增大，随着进给速度的增大而减小。本研究将为超声振动辅助抛光工艺提供理论基础。
- 超声振动辅助抛光 /
- 钴铬钼合金 /
- 抛光力 /
- 表面质量
Abstract: Aiming at the difficult processing of CoCrMo alloy, the processing method of ultrasonic vibration assisted polishing is used to improve the processing effect. According to the motion characteristics of the ultrasonic vibration device, the speed of the single abrasive particle, the coordinate of the contact track between the single abrasive particle and the workpiece, and the force of the single abrasive particle are analyzed, and the polishing force prediction model for the polishing system is established. The effects of the spindle speed, feed speed and polishing depth on the surface quality of CoCrMo alloy are discussed and the validity of the prediction model is verified by experiments. The results show that the polishing force prediction model is consistent with the experiment. The polishing force increases with the increasing of spindle speed and polishing depth, and decreases with the increasing of feed speed. This research will provide a theoretical basis for the ultrasonic vibration-assisted polishing process.
- ultrasonic vibration assisted polishing /
- CoCrMo alloy /
- polishing force /
- surface quality

HTML全文

图 1 超声振动辅助加工基本原理图

Figure 1. Ultrasonic vibration assisted machining schematic diagram

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图 2 单磨粒抛光轨迹示意图

Figure 2. Single abrasive polishing trajectory diagram

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图 3 斜椭圆加工轨迹示意图

Figure 3. Oblique ellipse machining trajectory diagram

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图 4 抛光力几何关系示意图

Figure 4. Geometric relationship of polishing force diagram

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图 5 实验加工平台图

Figure 5. Experimental machining platform diagram

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图 6 三维形貌仪

Figure 6. 3D optical profilometer

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图 7 不同主轴转速下超声振动辅助抛光表面形貌

Figure 7. Ultrasonic vibration-assisted polishing surface morphology at different spindle speeds

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图 8 不同进给速度下超声振动辅助抛光表面形貌

Figure 8. Ultrasonic vibration-assisted polishing surface morphology at different feed rates

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图 9 不同抛光深度下超声振动辅助抛光表面形貌

Figure 9. Ultrasonic vibration-assisted polishing surface morphology at different polishing depths

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图 10 加工参数对抛光力的影响

Figure 10. Effect of machining parameters on polishing force

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表 1 实验加工参数

Table 1. Experimental processing parameters

参数	参数值
主轴转速/（r·min⁻¹）	1000、1500、2000、2500
进给速度/（mm·min⁻¹）	10、20、40、60
抛光头目数	1500#、3000#
抛光深度/μm	0.6、0.8、1.0、1.2、1.4

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