虚拟切片无损测量片层质量检测系统优化研究

甘勇; 莫宗杰

doi:10.13433/j.cnki.1003-8728.2017.0819

虚拟切片无损测量片层质量检测系统优化研究

doi: 10.13433/j.cnki.1003-8728.2017.0819

甘勇,
莫宗杰

1.
桂林电子科技大学机电工程学院, 广西桂林 541000

基金项目:

国家自然科学基金资助（51665008，51265007）

详细信息

作者简介:
甘勇(1973-),教授,博士,硕士生导师,研究方向为机械设计制造及自动化,ganyong@guet.edu.cn

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- 文章访问数: 385
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- 被引次数: 0
出版历程
- 收稿日期: 2016-04-08
- 刊出日期: 2017-08-05

Research on Precision Optimization of Inspection System Fornon-destructive Measurement of Chip Layer Mass via Virtual Slice

1.
School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guangxi Guilin 541000, China

摘要

摘要: 基于虚拟切片无损测量方法具有测量精度高、成本低、数据测量与处理快、可测量物体内部轮廓等特点。由于测量质量精度高，其测量装置中精密片层质量检测系统精度是研究的关键技术之一，直接影响微小单元体质量的计算精度。运用误差补偿与误差影响因素正交实验等技术手段，对精密片层质量检测系统的误差分析及优化。实验结果证明，实现了片层质量平均相对误差从19.36%降至5.52%，并且在各片层厚度条件下，相对误差皆保持平稳幅度。
- 虚拟切片 /
- 三维无损测量 /
- 片层质量检测系统 /
- 精度优化
Abstract: nondestructive measurement method via virtual slice has high accuracy, low cost of measurement, fast measurement and processing of data and which can be measured inside the object contour, due to high accuracy of mass measurement. The measurement accuracy of inspection system for precision slice massis one of the key technologies, directly affect the calculation accuracy of micro element body mass. Using the error compensation and orthogonal experiment of error influencing factors the error of inspection system of precision slice mass was analyzed and the system was optimized. The present results prove that the average relative error of slice mass decreased from 19.36% to 5.52%, and all of the relative error remain stable amplitude under various layer thickness.
- virtual chip /
- 3D nondestructive measurement /
- inspection system of precision slice mass /
- optimization of precision

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参考文献(15)

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