超声磨粒冲击加工去除模型建立与仿真

舒晨; 李新和; 卜佳南; 胡兴佳

doi:10.13433/j.cnki.1003-8728.2015.0910

超声磨粒冲击加工去除模型建立与仿真

doi: 10.13433/j.cnki.1003-8728.2015.0910

1.
中南大学高性能复杂制造国家重点实验室, 长沙 410083

详细信息

作者简介:
舒晨（1988-），硕士研究生，研究方向为硬脆性难加工材料的超声表面光整技术和大径厚比薄壁筒形件超声旋压加工等，shuchen985@163.com

通讯作者:
李新和，教授，博士，li_xinhe@163.com

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- 被引次数: 0
出版历程
- 收稿日期: 2013-12-19
- 刊出日期: 2015-09-05

Removal Model Establishing and Simulation of Ultrasonic Abrasive Impacts

1.
State Key Laboratory of High Performance and Complex Manufacturing, Central South University, Changsha 410083, China

摘要

摘要: 运用脆性材料的临界切削深度理论，结合Hertz弹性接触理论和运动学方程对超声波磨粒冲击去除机理进行了理论分析，并采用光滑质点流体动力学（SPH）方法，研究了加工过程中磨粒冲击对脆性材料裂纹形成及扩展的影响。结果表明：光学石英玻璃的临界切削深度为0.013 μm。采用粒度为W7的磨粒，加工间隙一定，超声工具头端面振幅在约低于23.87 μm加工时，可实现在延性模式下研抛出高质量的石英玻璃表面；当振幅高于23.87 μm时，可实现在脆性断裂模式下对玻璃表面的高效率研磨。仿真结果表明：脆性材料在磨粒冲击过程中首先表现为弹塑性变形，当达到材料的临界断裂应力时，材料内部开始出现裂纹。
- 超声磨粒冲击 /
- 光学石英玻璃 /
- 临界切削深度 /
- 光滑质点流体力学（SPH）
Abstract: According to the critical-depth-of-cut model of brittle materials and combined with Hertz elastic contact theory and kinematics equations, we analyze the removal mechanisms of ultrasonic abrasive impacts theoretically. The Smooth Particle Hydrodynamics (SPH) Method was used to study the mechanisms of crack formation and extension of brittle material under the impact of the abrasive. The results indicate that the critical-depth-of-cut of optical quartz glass is 0.013 μm; if the machining clearance is set to a specific range and the W7 SiC abrasive particle is used, the high-quality surface of optical quartz glass can be polished under the ductile mode when the amplitude of ultrasonic tool is less than 23.87 μm, and the high-efficiency grinding can be realized under the brittle fracture mode when the amplitude is more than 23.87 μm. The simulation results show that the brittle materials performs elastic-plastic deformation in the process of abrasive impacts, and the crack begin to form in the interior of the material when the critical fracture stress is achieved.
- abrasion /
- brittle fracture /
- brittleness /
- calculations

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参考文献(16)

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