Simulation and Analysis on Micro Pit Array of Titanium Alloy with Hydrophobic Surface by Mask Electrochemical Micromachining
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摘要: 为改善钛合金疏水性能, 获得较高的接触角, 使用掩膜电解技术对钛合金进行了凹坑阵列表面微织构的加工。首先, 建立微坑阵列掩膜电解加工的数学模型并进行多物理场耦合仿真; 其次, 分析掩膜电解加工参数对微坑阵列的作用, 并借助润湿理论模型获得微坑阵列的固-液接触面积比; 最后, 以该面积比为因变量, 以电解质质量分数、电解电压和掩膜尺寸为自变量, 进行正交试验仿真和极差分析, 获得最佳工艺参数组合。与仿真预测值相比, 微坑阵列单元体直径、间距、深度、固-液接触面积比和表面接触角的测量值误差均小于8%, 从而表明该方法在未经低表面能材料修饰的情况下, 成功制备了接触角约为140°的微坑阵列。Abstract: In order to obtain a higher contact angle and improve its hydrophobicity, the micro texture on the surface of dimple array of titanium alloy was machined by using the mask electrolysis technology. Firstly, a model for micro pit array mask electrochemical machining is established and multi physical field coupling simulation is carried out; Secondly, the effect of the mask electrochemical machining parameters on the micro pit array is analyzed, and the solid-liquid contact area ratio of the micro pit array is obtained by means of the wetting theory model; Finally, with the area ratio as the dependent variable, the electrolyte mass fraction, electrolytic voltage and mask size as the independent variables, the orthogonal experiment simulation and range analysis were carried out to obtain the best combination of process parameters. Comparing with the predicted values, the errors of the measured values of cell diameter, spacing, depth, solid-liquid contact area ratio and surface contact angle are less than 8%, which indicates that the micro pit array with a contact angle of about 140° is successfully fabricated without modification of low surface energy materials.
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表 1 仿真模型的相关参数设定表
基本参数 数值 初始电导率/(S·m-1) 4.36/11.6/16.06 电解液密度/(g·cm-3) 1.05/1.1/1.3 常压比热容/[J·(kg·℃)-1] 4200 电解液流量/(L·min-1) 1.7 热传导系数/[W·(m·K)-1] 0.6 动力黏度/(Pa·s) 1.01×10-3 TC4密度/(g·cm-3) 4.5 TC4摩尔质量/(g·mol-1) 46.6 
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表 2 工艺参数及水平表
水平 电解质质量分数A/% 电解电压B/V 掩膜尺寸C/μm 1 5 10 190 & 25 2 15 15 200 & 70 3 30 20 200 & 100
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表 3 微坑阵列仿真接触面积比计算结果
序号 A B C λ 1 1 1 1 0.46 2 1 2 2 0.47 3 1 3 3 0.50 4 2 1 2 0.42 5 2 2 3 0.45 6 2 3 1 0.44 7 3 1 3 0.46 8 3 2 1 0.42 9 3 3 2 0.40
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表 4 微坑阵列仿真与实测误差分析
参数 仿真预测 实测 误差 凹坑直径/μm 245 251.9 2.82% 单元间距/μm 26 24.3 6.54% 平均深度/μm 39.2 42.2 7.65% 固-液接触面积比 0.36 0.347 3.61% 接触角/(°) 150.7 140.25 6.93%
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