Finite Element Analysis of Wafer Warp Slicing by Wire-saw of Bi2Te3
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摘要: 碲化铋基热电材料切片的翘曲度对热电制冷片的质量有重要影响, 是多线切割过程中必须控制的质量因素。通过建立多线切片过程的顺序耦合热应变分析有限元模型, 以切片表面节点位移反映切片翘曲度。首先建立温度场三维有限元模型, 模拟切割过程温度场分布; 然后以温度场结果为边界条件, 建立热应变分析模型; 按照不同的张紧力、进给速度、线速度工艺参数组合进行仿真模拟, 计算出相应的翘曲度值, 研究翘曲度与各工艺参数之间的关系。结果表明: 张紧力增加, 翘曲度减小; 进给速度增加, 翘曲度增大; 线速度增大, 翘曲度增大。Abstract: The warp of bismuth telluride-based thermoelectric material wafers, which is must be controlled in the multi-wire slicing process, has an important influence on the quality of thermoelectric cooling sheets. In order to reflect the wafer warp by the node displacement of sliced wafer surface, a finite element model for sequential coupled thermal strain analysis in the multi-wire slicing process was established. Firstly, a three-dimensional finite element model for the temperature field was established to simulate the temperature distribution in the slicing process. And then the temperature field was used as a boundary condition to establish a thermal strain analysis model. The model with different combinations of tension, feed speed and wire speed was also simulated and the corresponding warping degree value was calculated. Finally, the results demonstrated that the warp increases with the increasing of feed and wire speeds, and the warp decreases with the increasing of tension force.
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表 1 碲化铋晶棒物理参数
密度/(g·cm-3) 7.859 热导率/(W·(m·K)-1) 1.5 膨胀系数/(×10-6·K) 1.5×10-5 比热/(J·(kg·K)-1) 2.33×10-6 杨氏模量/GPa 510 泊松比 0.063 6 
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