微细电解加工中空电极侧壁绝缘层的制备工艺研究

温杰超; 孔全存; 刘桂礼; 牛献礼; 田元波

doi:10.13433/j.cnki.1003-8728.20190150

微细电解加工中空电极侧壁绝缘层的制备工艺研究

doi: 10.13433/j.cnki.1003-8728.20190150

1.
北京信息科技大学仪器科学与光电工程学院, 北京 100192
2.
北京信息科技大学精密测量技术与仪器研究所, 北京 100192

基金项目:

北京市自然科学基金项目 3172013

国家自然科学基金面上项目 51675054

北京市教委科技发展计划面上项目 KM201711232005

详细信息

作者简介:
温杰超(1991-), 硕士研究生, 研究方向为微细电解加工, 625167163@qq.com

通讯作者:
孔全存, 副教授, 硕士生导师, 博士, kongquancun@163.com

中图分类号: TG662
计量
- 文章访问数: 568
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- PDF下载量: 23
- 被引次数: 0
出版历程
- 收稿日期: 2019-03-20
- 刊出日期: 2020-03-05

Preparing Hollow-electrode Sidewall-insulating Film Through Electrochemically Machining Micro-holes

1.
School of Instrumentation Science and Opto-Electronics Engineering, Beijing Information Science and Technology University, Beijing 100192, China
2.
Institute of Precision Measuring Technology and Instruments, Beijing Information Science & Technology University, Beijing 100192, China

摘要

摘要: 针对孔径100~200 μm高深宽比微细孔电解加工中，电极侧壁绝缘层在电解液冲击和气泡撕裂中易损伤/脱落等问题，本文提出一种丙烯酸环氧树脂电泳法的中空电极侧壁绝缘制备工艺。通过优化工艺参数并开展加工实验，比较加工孔尺寸及形貌、加工后电极表面形态，结果表明丙烯酸环氧树脂电泳法制备的中空电极侧壁绝缘层，具有较高的致密性、均匀性、耐久性和一致性。最后，在500 μm厚304不锈钢片上加工出入口180.6 μm、出口173.8 μm、深宽比约为3的微细阵列孔，其锥度比非侧壁绝缘电极加工的孔减少了约70%以上，基本为直孔，可满足实际需求，进而验证了本方法的应用可行性。
- 微细电解加工 /
- 中空电极 /
- 侧壁绝缘 /
- 丙烯酸环氧树脂 /
- 电泳 /
- 微细孔 /
Abstract: To electrochemically machine (ECM) a high-aspect-ratio micro-hole with the diameter of 100~200 μm and to reduce the easy fracture or falling off of the sidewall-insulating film on hollow electrode, a novel method of hollow-electrode sidewall-insulating preparation of micro-hole using the acrylic epoxy resin electrophoresis method was proposed. The process parameters were optimized; the machining experiments were carried out; the size and morphology of the machined hole and the machined electrode surface were compared. The results show that the sidewall-insulating film prepared with the acrylic epoxy resin electrophoresis method is highly compact and has uniformity, durability and consistency. Finally, the hollow-electrode sidewall-insulating film was prepared with the above-mentioned method. A high-aspect-ratio micro-hole array was machined on a stainless 304 steel plate with the thickness of 500 μm. The diameters of a typical micro-hole at its inlet and outlet are 180.6 μm and 173.8 μm, respectively, and the taper of the micro-hole is about 70% lower than that of the hollow-electrode non-sidewall-insulating film. Moreover, the micro-holes are basically straight.
- electrochemically machining /
- hollow electrode /
- sidewall-insulation /
- acrylic epoxy resin /
- electrophoresis /
- high aspect ratio /
- micro-hole

HTML全文

图 1 微细中空电极

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图 2 中空电极电泳镀膜过程示意

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图 3 因素A、B、C对镀膜厚度的影响趋势

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图 4 膜厚度与浓度比及烘焙时间变化趋势

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图 5 膜厚度与电压及烘焙时间变化趋势

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图 6 膜厚度与电泳时间及烘焙时间变化趋势

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图 7 丙烯酸环氧树脂侧壁绝缘中空电极

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图 8 微细电解加工实验装置

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图 9 三种侧壁绝缘电极加工孔径尺寸对比

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图 10 三种侧壁绝缘电极加工的微细孔形貌

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图 11 PI和环氧树脂电极加工浅微细孔形态

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图 12 加工后电极表面形态

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图 13 未侧壁绝缘电极加工的阵列孔

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图 14 环氧树脂侧壁绝缘电极加工的阵列孔

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表 1 影响电泳镀膜厚度的因素与水平

水平	因素
水平	A配比	B电压/V	C时间/s
1	1:1	3	10
2	1:5	6	50
3	1:10	9	90

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表 2 电泳镀层ABC控制参数的实验结果

序号	因素			厚度/μm
序号	A配比	B电压/V	C时间/s	厚度/μm
1	1	1	1	20.5
2	1	2	2	29.4
3	1	3	3	36.3
4	2	1	2	16.8
5	2	2	1	26.5
6	2	3	3	26.3
7	3	1	3	10
8	3	2	1	12.4
9	3	3	2	17.8
k₁	28.7	15.7	19.7
k₂	23.2	22.7	21.3
k₃	13.4	26.8	24.3
R	15.3	11.0	4.5

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