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SPCC胶接点焊胶层气体的排出及超声C扫检测分析

韦涛 曾凯 冯煜阳 肖智杰 吴万平

韦涛, 曾凯, 冯煜阳, 肖智杰, 吴万平. SPCC胶接点焊胶层气体的排出及超声C扫检测分析[J]. 机械科学与技术, 2018, 37(7): 1115-1119. doi: 10.13433/j.cnki.1003-8728.2018.0716
引用本文: 韦涛, 曾凯, 冯煜阳, 肖智杰, 吴万平. SPCC胶接点焊胶层气体的排出及超声C扫检测分析[J]. 机械科学与技术, 2018, 37(7): 1115-1119. doi: 10.13433/j.cnki.1003-8728.2018.0716
Wei Tao, Zeng Kai, Feng Yuyang, Xiao Zhijie, Wu Wanping. Gas Discharge and Ultrasonic C Scanning Analysis of SPCC Adhesive Spot Welding Layer[J]. Mechanical Science and Technology for Aerospace Engineering, 2018, 37(7): 1115-1119. doi: 10.13433/j.cnki.1003-8728.2018.0716
Citation: Wei Tao, Zeng Kai, Feng Yuyang, Xiao Zhijie, Wu Wanping. Gas Discharge and Ultrasonic C Scanning Analysis of SPCC Adhesive Spot Welding Layer[J]. Mechanical Science and Technology for Aerospace Engineering, 2018, 37(7): 1115-1119. doi: 10.13433/j.cnki.1003-8728.2018.0716

SPCC胶接点焊胶层气体的排出及超声C扫检测分析

doi: 10.13433/j.cnki.1003-8728.2018.0716
基金项目: 

国家自然科学基金项目(51565022)资助

详细信息
    作者简介:

    韦涛(1994-),硕士研究生,研究方向为材料连接及质量检测分析、结构可靠性设计,840304572@qq.com

    通讯作者:

    曾凯,硕士生导师,博士,kmzk201109@163.com

Gas Discharge and Ultrasonic C Scanning Analysis of SPCC Adhesive Spot Welding Layer

  • 摘要: 制备SPCC板材电阻点焊胶接接头,并开展拉伸-剪切试验;建立胶接点焊接头的Euler-Lagrange分析模型,提取胶层界面各个检测点压力时程曲线,分析焊接过程中胶层受热气化过程对熔池产生的冲击;同时,采用超声波水浸聚焦入射法对SPCC板材胶接点焊接头进行超声C扫描成像检测,借助焊点区A扫信号和C扫图像分析接头焊核区的形貌特征。结果表明:胶接接头和点焊接头的抗拉强度均值分别为10 518.325 N和10 164.421 N,胶层的加入提高了点焊接头的强度;胶接点焊过程中胶层气化后的高压气体从上下板之间的空隙排出,并在焊核区周围留下气体排出后的空腔区;基于超声C扫图像特征,将胶接接头分为导电胶层区、胶层气化后的气体排出的空腔区以及熔核区,检测分析结果与仿真分析相吻合。
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出版历程
  • 收稿日期:  2017-08-20
  • 刊出日期:  2018-07-05

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