微坑阵列掩膜电解加工试验研究

王阳; 傅秀清; 王清清; 张震

doi:10.13433/j.cnki.1003-8728.2018.0612

微坑阵列掩膜电解加工试验研究

doi: 10.13433/j.cnki.1003-8728.2018.0612

王阳¹,
傅秀清^1,2, ,,
王清清¹,
张震¹

1.
南京农业大学工学院, 南京 210031;
2.
江苏省智能农业装备重点实验室, 南京 210031

基金项目:

江苏省数字化电化学加工重点建设实验室开放基金项目（KFJJ2004004）、江苏省政策引导类计划前瞻性联合研究项目（BY201507102）及国家大学生创新训练项目（201710307095）资助

详细信息

作者简介:
王阳(1995-),本科生,研究方向为特种加工,1057936185@qq.com

通讯作者:
傅秀清,副教授,博士,fuxiuqing@njau.edu.cn

计量
- 文章访问数: 225
- HTML全文浏览量: 42
- PDF下载量: 8
- 被引次数: 0
出版历程
- 收稿日期: 2017-06-07
- 刊出日期: 2018-06-05

Experimental Study on Electrochemical Machining of Micro Pits Array Mask

1.
College of Engineering, Nanjing Agricultural University, Nanjing 210031, China;
2.
Jiangsu Key Laboratory for Intelligent Agricultural Equipment, Nanjing 210031, China

摘要

摘要: 为了解决机械零件表面织构的加工问题，并充分利用电解加工的优势，本文基于COMSOL Multiphisics软件进行了微坑阵列掩膜电解加工过程的仿真分析，开展了电解加工零件表面微织构的工艺试验研究，得到了具有微米级别直径与深度的表面阵列微坑，总结了普通直流加工电压与加工时间、脉冲电流加工频率与占空比、不同掩膜孔直径对微坑加工的工艺规律。试验结果表明：在加工时间12 s，脉冲电压12 V，占空比30%，脉冲频率3 000 Hz，掩膜孔径200 μm的参数下，能得出表面质量最优的微坑。
- 微坑阵列 /
- 掩膜电解加工 /
- 仿真分析 /
- 工艺试验
Abstract: In order to solve the manufacturing of surface texture on mechanical parts and make full use of the advantages of electrochemical machining, based on the COMSOL multiphisics software, the electrochemical machining of mask micro-dimples array simulation analysis and the electrochemical machining of surface texture on mechanical parts experience study were carried out. The diameter and depth in nano size on the surface micro-dimples array were available and the technological rule of micro-dimples machining with common DC (Direct current) processing voltage and processing time, processing impulse current frequency and duty cycle,different diameter of mask holes were carried out. The results showed that the optimal micro-dimples with surface quality is the processing time of 12 s, pulse voltage of 12 V,duty cycle of 30%,pulse frequency of 3 000 Hz, pore size of mask of 200 μm.
- mask micro-dimples array /
- electrochemical machining /
- simulation /
- technological experiment

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参考文献(15)

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