PDMS基体等离子法键合工艺及效果分析

崔东旭; 张若愚; 俞天; 戴隆超

doi:10.13433/j.cnki.1003-8728.2018.0520

PDMS基体等离子法键合工艺及效果分析

doi: 10.13433/j.cnki.1003-8728.2018.0520

1.
扬州大学机械工程学院, 江苏扬州 225127

基金项目:

国家自然科学基金项目（11372269）资助

详细信息

作者简介:
崔东旭(1992-),硕士研究生,研究方向为柔性电子,1041254428@qq.com

通讯作者:
戴隆超,副教授,硕士生导师,lcdai@yzu.edu.cn

计量
- 文章访问数: 274
- HTML全文浏览量: 41
- PDF下载量: 32
- 被引次数: 0
出版历程
- 收稿日期: 2017-04-17
- 刊出日期: 2018-05-05

Analysis of Plasma Bonding Process and Effect for PDMS

1.
College of Mechanical Engineering, Yangzhou University, Jiangsu Yangzhou 225127, China

摘要

摘要: 为探究聚二甲基硅氧烷（PDMS）基体在等离子法下以不同工艺参数处理及处理后在不同键合时间，键合加载压力下的PDMS-PDMS键合效果，设计进行了3因素4水平正交试验及对比试验。试验结果表明：因素影响从主到次的顺序为空气流量、改性时间、射频功率，得到快速不可逆键合（键合5 min）工艺参数：400 W，2.5 L/min，2 min；中、高射频功率（300 W以上）键合10 h键合效果达到实验要求，低射频功率（200 W以下）键合超过24 h仍未达到试验要求；当键合加载压力超过0.4 MPa时，键合效果显著提升。
- 等离子法 /
- 正交试验 /
- 不可逆键合 /
- 键合效果
Abstract: To explore the bonding effect of the polydimethylsiloxane(PDMS)substrate handled with different bonding time and bonding pressure after different process parameters of the plasma treatment. The three factor-four level-orthogonal tests and contrast tests was designed. The experimental results indicate that the sequence of the factors which organized by their influence is of:air flow rate > treatment time > radio frequency (RF)power. The parameters to get rapid irreversible bonding (Bonding 5 min) is:400 W, 2.5 L/min, 2 min. Under the middle or high RF power (300 W or higher), the bonding effects can meet the requirement with 10 h bonding. Under the low RF power (200 W or lower), the bonding effect can not meet the requirement after 24 hours. The bonding effect is significantly improved when the bonding pressure is more than 0.4 MPa.
- plasma treatment /
- orthogonal tests /
- irreversible bonding /
- bonding effect

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参考文献(15)

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