X-Y平面联动的平面研磨轨迹分析与研磨实验

刘清; 张广鹏; 高智学; 黄玉美

doi:10.13433/j.cnki.1003-8728.2018.0054

X-Y平面联动的平面研磨轨迹分析与研磨实验

doi: 10.13433/j.cnki.1003-8728.2018.0054

刘清^1,2,
张广鹏^1, ,,
高智学¹,
黄玉美¹

1.
西安理工大学机械与精密仪器工程学院, 西安 710048;
2.
陕西工业职业技术学院, 陕西咸阳 712000

基金项目:

陕西省机械制造装备重点实验室基金项目（14JS062）资助

详细信息

作者简介:
刘清(1972-),博士研究生,研究方向为精密加工技术,liuqing2007@126.com

通讯作者:
张广鹏,教授,博士生导师,gpzhang@xaut.edu.cn

计量
- 文章访问数: 201
- HTML全文浏览量: 35
- PDF下载量: 6
- 被引次数: 0
出版历程
- 收稿日期: 2017-09-07
- 刊出日期: 2018-06-05

Experimental Study of X-Y Linkage Plane Lapping Track

1.
School of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an 710048, China;
2.
Shaanxi Polytechnic Institute, Shaanxi Xianyang 712000, China

摘要

摘要: 针对传统研磨方法的研磨轨迹覆盖均匀性等问题，开展了X-Y联动的平面研磨轨迹仿真与实验研究。建立了该X-Y联动的平面研磨轨迹运动模型，仿真分析了初始向径、初始相位角、转速比、X-Y联动轨迹等参数对研磨轨迹的影响规律；在自主研发的样机平台上开展了研磨实验研究。对试件研磨表面的平面度与粗糙度进行检测，验证了研磨轨迹曲线仿真方法的有效性，表明良好的研磨组合参数是提升研磨表面质量的必要因素。
- 研磨加工 /
- 研磨轨迹仿真 /
- X-Y联动的平面研磨
Abstract: Some problems of coverage uniformity last for a long time in the traditional plane lapping, simulation and experiments are carried out to investigate the X-Y linkage plane lapping track, whose motion model is established. Effects of four parameters on the lapping trajectory are simulated, including initial diameter, the phase angle of initial point, speed ratio and X-Y linkage plane lapping track. Then, experiments on the plane lapping are conducted for a self-developed plane lapping machine tool. The flatness and roughness of its lapping surface are measured. The experimental results ensure the effectiveness of the lapping trajectory simulation method and show that the reasonable combination of lapping parameters is an essential factor for improving the surface quality.
- plan lapping track /
- simulation /
- X-Y linkage plane lapping

HTML全文

参考文献(15)

[1]	方开泰,马长兴.正交与均匀试验设计[M].北京:科学出版社,2001 Fang K T, Ma C X. Orthogonal and uniform experimental design[M]. Beijing:Science Press, 2001(in Chinese)
[2]	陶黎.半固着磨具加工均匀性仿真与实验研究[D]. 杭州:浙江工业大学,2009 Tao L. Simulation and experiment on the lapping uniformity with semi-fixed abrasive plate[D]. Hangzhou:Zhejiang University of Technology, 2009(in Chinese)
[3]	赵文宏,周兆忠,文东辉,等.定偏心和不定偏心平面研磨均匀性的研究[J].金刚石与磨料磨具工程,2006,(3):46-49 Zhao W H, Zhou Z Z, Wen D H, et al. Research on the uniformity of certain and uncertain eccentricity plane lapping processes[J]. Diamond & Abrasives Engineering, 2006,(3):46-49(in Chinese)
[4]	周兆忠,郑家锦,袁巨龙.定偏心平面研磨均匀性研究[J].现代制造工程,2005,(5):14-16 Zhou Z Z, Zheng J J, Yuan J L. Research on the finishing uniformity of certain eccentricity plane lappinge[J]. Modern Manufacturing Engineering, 2005,(5):14-16(in Chinese)
[5]	杨金双,朱祥龙.行星式双面研磨轨迹均匀性研究[J].机械研究与应用,2015,28(6):41-43 Yang J S, Zhu X L. Research on uniformity of trajectory in planetary double-side lapping process[J]. Mechanical Research Long and Application, 2015,28(6):41-43(in Chinese)
[6]	姬孟托,洪滔,文东辉,等.无理数转速比下的平面研磨轨迹均匀性研究[J].机电工程,2016,33(5):532-536 Ji M T, Hong T, Wen D H, et al. Analytical study on uniformity of path distribution with irrational rotational speed ratio in plan lapping process[J]. Journal of Mechanical & Electrical Engineering, 2016,33(5):532-536(in Chinese)
[7]	杨昌明,朱利,张冒.研磨机研磨运动轨迹分析[J].机床与液压,2012,40(15):7-9 Yang C M, Zhu L, Zhang M. Analysis of grinding trajectory of lapping machine[J]. Machine Tool & Hydraulics, 2012,40(15):7-9(in Chinese)
[8]	焦安源,全洪军,邹艳华.平面研磨中磁粒刷运动轨迹规划的试验研究[J].机械设计与制造,2015,(10):84-87 Jiao A Y, Quan H J, Zou Y H. Experimental study on planning the trajectory of magnetic abrasive brush in plane finishing[J]. Machinery Design & Manufacture, 2015,(10):84-87(in Chinese)
[9]	焦安源,邹艳华.平面磁力研磨轨迹的研究与分析[J].制造技术与机床,2011,(10):90-93 Jiao A Y, Zou Y H. Study and analysis on plane magnetic abrasive trajectory[J]. Manufacturing Technology & Machine Tool, 2011,(10):90-93(in Chinese)
[10]	程相文,王凌霄.四轴球体研磨机研磨轨迹的研究[J].制造业自动化,2013,35(10):98-100,107 Cheng X W, Wang L X. Research on lapping trace of four cup lapping machine[J]. Manufacturing Automation, 2013,35(10):98-100,107(in Chinese)
[11]	赵萍,陶黎,王志伟,等.平面研磨抛光轨迹研究[J].航空精密制造技术,2009,45(2):1-6 Zhao P, Tao L, Wang Z W, et al. Review on trace of plane lapping/polishing[J]. Aviation Precision Manufacturing Technology, 2009,45(2):1-6(in Chinese)
[12]	Kametz D A. Precision fabrication and development of charging and testing methods of fixed-abrasive lapping plates[D]. Raleigh:North Carolina State University, 2003
[13]	Zhang L, Tam H Y, Yuan C M, et al. An investigation of material removal in polishing with fixed abrasives[J]. Proceedings of the Institution of Mechanical Engineers, Part B:Journal of Engineering Manufacture, 2002,216(1):103-112
[14]	Castillo-Mejia D, Beaudoin S. A locally relevant prestonian model for wafer polishing[J]. Journal of the Electrochemical Society, 2003,150(2):G96-G102
[15]	Kametz D A. Precision fabrication and development of charging and testing methods of fixed-abrasive lapping plates[D]. Raleigh:North Carolina State University, 2003