BGA/CSP植球机供球机构的设计及应用

刘劲松; 时威; 张金志

doi:10.13433/j.cnki.1003-8728.2016.1210

BGA/CSP植球机供球机构的设计及应用

doi: 10.13433/j.cnki.1003-8728.2016.1210

1.
上海理工大学机械工程学院, 上海 200093;
2.
上海微松工业自动化有限公司, 上海 201114

基金项目:

上海市科学技术委员会科研计划项目（12510502500）资助

详细信息

作者简介:
刘劲松(1968-)教授,博士生导师,中央千人计划特聘专家,研究方向为高端半导体芯片制造装备和工业机器人应用系统集成,ljs@weisong.cn

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- 文章访问数: 240
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- 被引次数: 0
出版历程
- 收稿日期: 2015-02-11
- 刊出日期: 2017-01-05

Design and Application of Ball Supply Unit in BGA/CSP Ball Mounter

1.
School of Mechanical Engineering, University of Shanghai for Science and Technology Shanghai 200093, China;
2.
Shanghai Micson Industrial Automation Co., Ltd., Shanghai 201114, China

摘要

摘要: 研究设计BGA/CSP植球机的供球机构，采用翻转预埋方式供球，锡球直径0.15~0.76 mm，解决市场上常见植球机振动盘供球方式易造成锡球缺失和粘连问题。针对该供球方式水平定位精度要求高，对真空植球头和供球机构之间的定位误差进行分析，得出供球机构传动链回程误差对植球头吸球效果影响较大，设计了气缸夹紧机构进行位置补正。对气缸夹紧机构进行受力分析和力矩分析来选用合适的气缸。最后通过设备调试，供球机构铺球效果良好，植球头能够完全吸取锡球，为高植球精度打下基础。
- BGA /
- CSP /
- 植球机 /
- 供球机构 /
- 回程误差
Abstract: The ball supply unit is designed for the BGA/CSP (ball grid array, chip size package)ball mounter,it uses pre-buried method for ball supply and it can solve the problem of solder ball missing or conglutination, the ball size is from 0.15 mm to 0.76 mm. The ball supply unit requires high horizontal positioning precision. The mathematical model of alignment accuracy between the ball supply unit and the ball mount head is analyzed, and the error analysis shows that the backlash of the ball supply unit has a great influence on the commissioning of ball mount head. Because of the backlash error of the transmission chain, a mechanism is designed to eliminate the backlash. By calculating the stresses and torque, two suitable cylinders are selected. Finally, the experiments of commissioning indicate that the ball supply unit can realize the precision requirement of the ball mounter.
- BGA /
- CSP /
- package /
- ball mounter /
- ball supply unit

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参考文献(17)

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