SiC单晶片切割过程切割力的建模和预测

崔丹; 李淑娟; 胡超

doi:10.13433/j.cnki.1003-8728.2014.0810

SiC单晶片切割过程切割力的建模和预测

doi: 10.13433/j.cnki.1003-8728.2014.0810

1.
西安理工大学机械与精密仪器工程学院, 西安 710048

基金项目:

国家自然科学基金项目(51175420)

陕西省科技攻关项目(2010K09-01)

陕西省教育厅基金项目(11JK0849/11JS074)资助

详细信息

作者简介:
崔丹(1987-)，硕士研究生，研究方向为硬脆材料的切割机理，xautcuidan@126.com;李淑娟(联系人)，教授，博士生导师，shujuanli@xaut.edu.cn

崔丹(1987-)，硕士研究生，研究方向为硬脆材料的切割机理，xautcuidan@126.com;李淑娟(联系人)，教授，博士生导师，shujuanli@xaut.edu.cn

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- 被引次数: 0
出版历程
- 收稿日期: 2013-03-25

Modeling and Prediction for Cutting Force in SiC Monocrystal Wafers Processing Process

1.
School of Mechanical and Instrumental Engineering, Xi'an University of Technology, Xi'an 710048

摘要

摘要: SiC单晶具有良好的物理和机械性能,在大功率器件和IC行业有广泛的应用。但由于高的硬度和脆性,使其加工过程变得非常困难。切割力对SiC单晶片的切割质量、切割效率和切割过程的稳定性具有重要的影响,因此研究切割过程的切割力有重要的意义。分析了SiC单晶切割过程影响切割力的主要因素,采用中心复合设计法(CCD)进行了试验设计,考察线锯速度、工件进给速度、工件转速、线锯张紧力4个因素对切割单晶SiC切割力的影响。采用响应面分析法(response surface methodology,RSM)对金刚石线锯切割SiC单晶体的工艺参数进行分析优化,建立了单晶SiC切割力模型,并进行方差分析,表明了模型的可行性。并通过实验验证,结果表明该模型能有效的对切割过程中的切割力进行预测。
- SiC单晶 /
- 切割力 /
- RSM /
- 建模 /
- 预测
Abstract: SiC Monocrystal is widely used in high power devices and IC industry due to its good physical and mechanical properties. However,the processing process of SiC monosrystal wafers becomes very difficult due to its high hardness and brittleness. The cutting force has an important influence on the quality,productivity and stability of cutting process in SiC monocrystal wafer processing; therefore,it is significant to study the cutting force of the cutting process. This paper analyzes the influence factors on cutting force of the cutting process,the experiment scheme is designed by using Central Composite Design(CCD),and the wire saw velocity,part feed rate,part rotation speed and wire saw tension are considered as the factors on the cutting force of SiC processing. Response Surface Methodology(RSM) is used to optimize the processing parameters and the cutting force model is developed. Analysis of variance(ANOVA) is also carried out to verify the feasibility of the cutting force model. The experiments results show that the proposed model can predict the cutting force effectively in SiC monocrystal wafers cutting process.
- analysis of variance(ANOVA) /
- cutting force /
- cutting /
- design of experiments /
- diamond cutting tools

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参考文献(12)

[1]	王世忠，徐良瑛，束碧云，等. SiC 单晶的性质、生长及应用[J]. 无机材料学报，1999，14(4):527-534Wang S Z ，Xu L Y，Shu B Y，et al. Physicalproperties，bulk growth，and applications of SiC singlecrystal[J]. Journal of Inorganic Materials，1999，14(4):527-534 (in Chinese)
[2]	高玉飞，葛培琪，李绍杰. 往复式电镀金刚石线锯切割单晶硅片特性研究[J]. 人工晶体学报，2009，38(2):372-377Gao Y F，Ge P Q，Li S J. Study on the machiningperformance of single crystal silicon wafer cut by usingreciprocating electroplated diamond wire saw [J].Journal of Synthetic Crystals，2009，38(2):372-377 (in Chinese)
[3]	侯志坚，葛培琪，张进生，等. 利用金刚石线锯切割硅晶体的实验研究[J]. 金刚石与磨料磨具工程，2007，(5):14-16Hou Z J，Ge P Q，Zhang J S，et al. Experiment researchto cut crystal silicon using diamond wire saw[J].Diamond & Abrasives Engineering，2007，(5):14-16 (in Chinese)
[4]	Clark W I，Shih A J，Lemaster R L，et al. McSpadden.Fixed abrasive diamond wire machining part II:experiment design and results[J]. International Journalof Machine Tools & Manufacture，2003，(43):523-532(in Chinese)
[5]	陈秀芳，李娟，马德营，等. 金刚石线锯切割大直径SiC 单晶[J]. 功能材料，2005，36(10):1575--1577Chen X F，Li J，Ma D Y，et al. Slicing large-diameterSiC single crystal by using diamond wire saw[J].Journal of Functional Materials，2005，36 (10):1575-1577 (in Chinese)
[6]	高伟. 环形电镀金刚石线锯的制造及其切割技术与机理的研究[D]. 济南:山东大学，2002Gao W. Research on manufacturing processes，cuttingtechnology，and mechanism of electroplated diamondendless wire saws[D]. Jinan:Shandong University，2002(in Chinese)
[7]	孟剑峰. 环形电镀金刚石线锯加工技术及加工质量研究[D]. 济南:山东大学，2006Meng J F. Research on machined technology andmachined quality of endless electroplated diamond wiresaw [D]. Jinan: Shandong University，2006 (in Chinese)
[8]	张辽远，郭玉泉，赵延艳. 硬脆材料的电镀金刚石线锯超声切割锯切力研究[J]. 金刚石与磨料磨具工程，2008，(168):49-54Zhang L Y，Guo Y Q，Zhao Y Y. Research on sawingforces during ultrasonic vibration cutting of hard andbrittle materials with electroplated diamond wire saw[J].Diamond & Abrasives Engineering，2008，(168):49-54(in Chinese)
[9]	Godfrey O U，Kumar S. Response surface methodology-based approach to CNC drilling operations[J]. Journalof Materials Processing Technology，2006，171:41-47
[10]	Giovanni M. Response surface methodology and productoptimization [J]. Food Technology，1983，37 (11):41-45
[11]	Palanikumar K，Muthukrishnan N，Hariprasad K S. Surfaceroughness parameters optimization in machining A356/SiC/20p metal matrix composites by PCD tool usingresponse surface methodology and desirability function[J].Machining Science and Technology，2008，12:529-545
[12]	袁人炜，陈明，曲征洪，等. 响应曲面法预测铣削力模型及影响因素的分析[J]. 上海交通大学学报，2001，35 (7):1040-1045Yuan R W，ChenM，Qu Z H，et al. Milling forceprediction and analysis using statistics method [J].Journal of Shanghai Jiaotong University，2001，35(7):1040-1045 (in Chinese)