Stamping Forming Simulation of Electronic Component Based on LS-DYNA
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摘要: 针对电子元件结构尺寸较小,采用传统方法设计其成形模具效率低且很难保证质量,基于LS-DYNA接触碰撞算法,建立了工件、凸凹模的冲压成形有限元模型,定义了成形条件。在分析过程中通过创建接触界面来实现凸凹模与工件之间力和运动的传递。分析得到了工件应力应变分布图和成形性能图。采用接触碰撞算法可根据节点的时间-位移图来判断工件成形质量,并通过调整分析输入参数来获得最佳成形条件:凸凹模间隙和冲压速度。将仿真分析结果应用到模具设计和冲压工艺参数的拟订定中,实际生产表明仿真分析数据合理可靠。Abstract: In order to improve stamping forming efficiency and quality of an electronic component,the finite ele-ment models of workpiece and punch-matrix were established according to contact-impact algorithm along with con-tact pair. Then simulation analysis was carried out based on LS-DYNA contact-impact algorithm. In the analysis,the force and motion transmission between punch-matrix and workpiece were realized through the contact-impact in-terface defined. Strain-stress figure and forming limit diagram were obtained. Analysis results indicate that theforming property of workpiece was fine. In addition, this method can realize the checkout of stamping forming quali-ty. And the optimal forming factors,clearance and velocity of punch-matrix were obtained by adjusting the analysisinput parameters. The obtained results are well in agreement with practical product data.
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Key words:
- contact-impact algorithm /
- stamping forming /
- finite element method /
- simulation
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