BGA/CSP植球机供球机构的设计及应用

刘劲松; 时威; 张金志

doi:10.13433/j.cnki.1003-8728.2016.1210

BGA/CSP植球机供球机构的设计及应用

doi: 10.13433/j.cnki.1003-8728.2016.1210

1.
上海理工大学机械工程学院, 上海 200093;
2.
上海微松工业自动化有限公司, 上海 201114

基金项目:

上海市科学技术委员会科研计划项目（12510502500）资助

详细信息

作者简介:
刘劲松(1968-)教授,博士生导师,中央千人计划特聘专家,研究方向为高端半导体芯片制造装备和工业机器人应用系统集成,ljs@weisong.cn

计量
- 文章访问数: 218
- HTML全文浏览量: 26
- PDF下载量: 4
- 被引次数: 0
出版历程
- 收稿日期: 2015-02-11
- 刊出日期: 2017-01-05

Design and Application of Ball Supply Unit in BGA/CSP Ball Mounter

1.
School of Mechanical Engineering, University of Shanghai for Science and Technology Shanghai 200093, China;
2.
Shanghai Micson Industrial Automation Co., Ltd., Shanghai 201114, China

摘要

摘要: 研究设计BGA/CSP植球机的供球机构，采用翻转预埋方式供球，锡球直径0.15~0.76 mm，解决市场上常见植球机振动盘供球方式易造成锡球缺失和粘连问题。针对该供球方式水平定位精度要求高，对真空植球头和供球机构之间的定位误差进行分析，得出供球机构传动链回程误差对植球头吸球效果影响较大，设计了气缸夹紧机构进行位置补正。对气缸夹紧机构进行受力分析和力矩分析来选用合适的气缸。最后通过设备调试，供球机构铺球效果良好，植球头能够完全吸取锡球，为高植球精度打下基础。
- BGA /
- CSP /
- 植球机 /
- 供球机构 /
- 回程误差
Abstract: The ball supply unit is designed for the BGA/CSP (ball grid array, chip size package)ball mounter,it uses pre-buried method for ball supply and it can solve the problem of solder ball missing or conglutination, the ball size is from 0.15 mm to 0.76 mm. The ball supply unit requires high horizontal positioning precision. The mathematical model of alignment accuracy between the ball supply unit and the ball mount head is analyzed, and the error analysis shows that the backlash of the ball supply unit has a great influence on the commissioning of ball mount head. Because of the backlash error of the transmission chain, a mechanism is designed to eliminate the backlash. By calculating the stresses and torque, two suitable cylinders are selected. Finally, the experiments of commissioning indicate that the ball supply unit can realize the precision requirement of the ball mounter.
- BGA /
- CSP /
- package /
- ball mounter /
- ball supply unit

HTML全文

参考文献(17)

[1]	刘劲松,郭俭.BGA/CSP封装技术的研究[J].哈尔滨工业大学学报,2003,35(5):602-604 Liu J S, Guo J. BGA/CSP packaging techniques[J]. Journal of Harbin Institute of Technology, 2003,35(5):602-604 (in Chinese)
[2]	Cognetti C. The impact of semiconductor packaging technologies on system integration an overview[C]//Proceedings of IEEE Solid State Device Research Conference. Athens: IEEE, 2009:23-27
[3]	Mearig J, Goers B. An overview of manufacturing BGA technology[C]//Proceedings of the Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. Austin, TX: IEEE, 1995:434-437
[4]	Wang Y P, Lin V, Chen E, et al. CSP package and ball design for board level characteristic[C]//Proceedings of the 2011 IEEE 13th Electronics Packaging Technology Conference (EPTC). Singapore: IEEE, 2011:824-828
[5]	赖志明.先进封装技术FC/WLCSP的应用与发展[C]//中国电子学会电子制造与封装技术分会.2010中国电子制造技术论坛论文集.北京:中国电子学会电子制造与封装技术分会,2010:26 Lai Z M. The application and development of advanced FC/WLCSP package technology[C]//EMPT. 2010 China Electronic Manufacturing Technology Forum. Beijing: EMPT, 2010:26 (in Chinese)
[6]	王鹤,郭俭,石洋.圆带传动在植球机基板传送系统的应用与研究[J].机械传动,2014,38(7):171-173,178 Wang H, Guo J, Shi Y. Application and research of round belt transmission in substrate transfer system of ball mounter[J]. Journal of Mechanical Transmission, 2014,38(7):171-173,178 (in Chinese)
[7]	方兴.用于集成电路球栅阵列(BGA)封装的全自动植球机的研制开发[D].合肥:合肥工业大学,2005 Fang X. Robotics ball attachment work-cell for ball grid array semiconductor packages[D]. Hefei: Hefei University of Technology, 2005 (in Chinese)
[8]	郭建强.BGA全自动植球机视觉检测和自动对准控制技术研究[D].合肥:合肥工业大学,2006 Guo J Q. Study on machine vision inspection and automatic orientation control technology of full-automatic BGA ball mounting[D]. Hefei: Hefei University of Technology, 2006 (in Chinese)
[9]	夏链,吴斌,田晓青,等.基于虚拟样机的BGA供球机构动态性能仿真研究[J].合肥工业大学学报(自然科学版),2013,36(8):910-914 Xia L, Wu B, Tian X Q, et al. Dynamic performance simulation research on BGA ball feeding mechanism based on virtual prototype[J]. Journal of Hefei University of Technology, 2013,36(8):910-914 (in Chinese)
[10]	松下(中国)有限公司.Panasonic AC伺服(MINAS A5)系列产品样本综合版[Z].上海:松下(中国)有限公司,2009:313-141 Panasonic Industrial(China)Co., Ltd. Digital AC servo motor and drive MINAS A5[Z]. Shanghai:Panasonic Industrial (China) Co., Ltd., 2009:313-141 (in Chinese)
[11]	王文斌.机械设计手册[M].北京:机械工业出版社,2004:37-40 Wang W B. Machine design handbook[M]. Beijing: China Machine Press, 2004:37-40 (in Chinese)
[12]	Joubair A, Slamani M, Bonev I A. A novel XY-Theta precision table and a geometric procedure for its kinematic calibration[J]. Robotics and Compute-Integrated Manufacturing, 2012,28(1):57-65
[13]	刘劲松,郭俭.3D芯片封装晶圆植球装备关键技术研究[J].中国电子科学研究院学报,2013,8(6):573-577 Liu J S, Guo J. Technique on 3D IC package wafer ball mounting equipment[J]. Journal of CAEIT, 2013,8(6):573-577 (in Chinese)
[14]	李丹.传动装置齿隙位置对伺服系统的影响[J].重型机械科技,2004,(2):26-31 Li D. The influences to the servo system by the gear clearance of the driving device[J]. Heavy Machinery Science and Technology, 2004,(2):26-31 (in Chinese)
[15]	姚文席,张志强,黄蔚.摆线针轮行星减速机的回程误差分析[J].机械设计与研究,2000,(1):30-32 Yao W X, Zhang Z Q, Huang W. Analysis on the return error of cycloidal pin-wheel speed reducer[J]. Machine Design ＆ Research, 2000,(1):30-32 (in Chinese)
[16]	周超群,陈小安,合烨.伺服系统中精密传动装置精度分析[J].现代制造工程,2007,(4):73-76 Zhou C Q, Chen X A, He Y. Precision analysis of mechanical transmission in servo system[J]. Modern Manufacturing Engineering, 2007,(4):73-76 (in Chinese)
[17]	SMC(中国)有限公司.产品综合手册[Z].北京:SMC(中国)有限公司,2015:317-318 SMC(China)Co., Ltd. SMC-best pneumatics[Z]. Beijing: SMC(China)Co., Ltd., 2015:317-318 (in Chinese)