焊点形态、受力分析及QFN焊盘结构设计

朱朝飞; 贾建援; 张大兴; 付红志; 陈轶龙; 曾志

doi:10.13433/j.cnki.1003-8728.2016.0912

焊点形态、受力分析及QFN焊盘结构设计

doi: 10.13433/j.cnki.1003-8728.2016.0912

1.
西安电子科技大学机电工程学院, 西安 710071;
2.
中兴通讯股份有限公司, 深圳 518057

基金项目:

国家自然科学基金项目（61201021，51306134）与陕西省自然科学基础研究计划项目（2015JM6335）资助

详细信息

作者简介:
朱朝飞(1984-),博士研究生,研究方向为微电子机械系统(MEMS)和电子封装,zhuzhaofei100@126.com

通讯作者:
贾建援(联系人),教授,硕士,博士生导师,jyjia@xidian.edu.cn

计量
- 文章访问数: 276
- HTML全文浏览量: 51
- PDF下载量: 8
- 被引次数: 0
出版历程
- 收稿日期: 2015-08-10
- 刊出日期: 2016-09-05

Solder Joint Shape, Stress Analysis and Structure Design of QFN Pad

1.
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China;
2.
ZTE Corporation, Shenzhen 518057, China

摘要

摘要: 将QFN（Quad Flat No-Lead）封装器件通过表面贴装技术焊接到PCB（Printed Circuit Board）的过程中，熔化的焊点在器件与PCB间形成液桥。为了提高焊接的成功率，不仅要在PCB上设计合理的焊盘尺寸，还要了解液化焊点的形态及受力情况。利用毛细力学的理论，根据液态焊点的形态特征，建立焊点受力模型，在液态焊点体积恒定的条件下求解焊点的形态微分方程。根据液桥的形态特征参数和刚度特性曲线的变化，分析芯片的可焊接区间，并通过与Surface Evolver（SE）的仿真结果进行对比以证明方法的有效性。
- 方形扁平无引线封装 /
- 焊点形态 /
- 毛细力学 /
- 微分方程 /
- 力学模型
Abstract: In the process of a Quad Flat No-Lead package is soldered to Printed Circuit Board (PCB) through Surface mount technology, molten solder joint forming a liquid bridge between package and PCB. With a view to increasing the success rate of the welding, not only is a reasonable size of the pad designed on the PCB, but also the shape and stress of the solder joints have to be understood. In this paper, employing the theory of the capillary mechanics and according to the shape characteristics of the molten solder joint, a mechanical model for the solder is developed. Under the condition of a molten solder joint with a constant volume, the differential equations defining the shape of the solder are solved. According to the changes of the shape parameters and the stiffness characteristic curves, the welding interval is analyzed. By comparing the Surface Evolver (SE) simulations with those of the method employed in this paper, the validity of the method is demonstrated.
- Quad Flat No-Lead package /
- solder shape /
- capillary mechanics /
- differential equation /
- mechanical model

HTML全文

参考文献(16)

[1]	Huang J C Y. Reducing solder paste inspection in surface-mount assembly through mahalanobis-taguchi analysis[J]. IEEE Transactions on Electronics Packaging Manufacturing, 2010,33(4):265-274
[2]	Heinrich S M, Elkouh A F, Nigro N J, et al. Solder joint formation in surface mount technology-Part I: analysis[J]. Journal of Electronic Packaging, 1990,112(3):210-218
[3]	Chiang K N, Chen W L. Electronic packaging reflow shape prediction for the solder mask defined ball grid array[J]. Journal of Electronic Packaging, 1998,120(2):175-178
[4]	Chen W H, Chiang K N, Lin S R, et al. Prediction of liquid formation for solder and non-solder mask defined array packages[J]. Journal of Electronic Packaging, 1999,124(1):37-44
[5]	Zhong W H, Chan Y C, Alam M O, et al. Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints[J]. Journal of Alloys and Compounds, 2006,414(1-2):123-130
[6]	Jin J C, Yu Q, Shibutani T, et al. The assessment of influence of the design factors on the reliability of bga solder joints[J]. Key Engineering Materials, 2005,297-300:1822-1827
[7]	Wang Y, Olorunyomi M, Dahlberg M, et al. Process and pad design optimization for 01005 passive component surface mount assembly[J]. Soldering & Surface Mount Technology, 2007,19(1):34-44
[8]	Krammer O. Modelling the self-alignment of passive chip components during reflow soldering[J]. Microelectronics Reliability, 2014,54(2):457-463
[9]	Gao S Q, Zhou Y H. Self-alignment of micro-parts using capillary interaction: unified modeling and misalignment analysis[J]. Microelectronics Reliability, 2013,53(8):1137-1148
[10]	Luan J Y, Blackie C. Analysis and experimental study of the package stresses in a QFN plastic-encapsulated package[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014,4(8):1303-1308
[11]	Mastrangeli M, Arutinov G, Smits E C P, et al. Modeling capillary forces for large displacements[J]. Microfluidics and Nanofluidics, 2015,18(4):695-708
[12]	Tee T Y, Zhong Z W. Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis[J]. Microelectronics Reliability, 2004,44(1):105-114
[13]	Huang C Y, Wu Z H, Zhou D J. Solder joint formation simulation and reliability study of quad flat no lead package[J]. Science and Technology of Welding and Joining, 2007,12(1):100-105
[14]	Bonn D, Eggers J, Indekeu J, et al. Wetting and spreading[J]. Reviews of Modern Physics, 2009,81(2):739-805
[15]	Langbein D. Canthotaxis/wetting barriers/pinning lines in capillary surfaces[M]//Langbein D. Capillary Surfaces. Heidelberg: Springer Berlin, 2002: 149-177
[16]	Bill C J, Hu B, Lin M, et al. Advanced QFN packaging for low cost and solution[C]//Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging, Xi'an: IEEE, 2010:45-49